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W25X10C2SNIG
Manufacturer:Winbond
Packing:SOP
Date code:12+
Quantity:3000
Detailed Description:NOR Flash Serial (SPI, Dual SPI, Quad SPI) 2.5V/3.3V 1M-bit 128K x 8 8ns 8-Pin SOIC
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Product Details
EU RoHSCompliant 
ECCN (US)EAR99
Part StatusActive
HTS8542.32.00.71
MountingSurface Mount
Lead ShapeGull-wing
Package Length5(Max)
Package Width4(Max)
Package Height1.5(Max)
PCB changed8
Cell TypeNOR
Chip Density (bit)1M
ArchitectureSectored
Boot BlockNo
Block OrganizationSymmetrical
Address Bus Width (bit)24
Sector Size4Kbyte x 32
Page Size256byte
Number of Bits/Word (bit)8
Number of Words128K
ProgrammabilityYes
Timing TypeSynchronous
Max. Access Time (ns)8
Maximum Erase Time (s)1/Chip
Maximum Programming Time (ms)0.8/Page
Interface TypeSerial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V)2.3
Typical Operating Supply Voltage (V)2.5|3.3
Maximum Operating Supply Voltage (V)3.6
Operating Current (mA)14
Program Current (mA)12
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)85
Supplier Temperature GradeIndustrial
Command CompatibleYes
ECC SupportNo
Support of Page ModeNo
Minimum Endurance (Cycles)100000
Standard Package NameSOP
Supplier PackageSOIC
Pin Count8
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